Shine By Strength.

Process upgrade of the whole series of products

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Non Destructive Cutting Technology

Using low-temperature laser technology combined with the principle of thermal expansion and cold contraction large silicon wafers are naturally separated by thermal stress
The cutting surface is very smooth without any microcracks
The mechanical strength is equivalent to the overall strength of the battery which is much higher than the traditional cut battery

MBB Technology

Adopting a thinner and narrower main grid design can increase the output power of photovoltaic modules by 2% Has become the mainstream of the industry, significantly reducing the power loss of current transmission So that the module has higher light utilization and better crack resistance.

 

25 YEAR POWER WARRANTY

≤2%

First year attenuation

≤0.55%

Linear attenuation

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0-3% POSITIVE TOLERANCE

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STRICT QUALITY CONTROL

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EXCELLENT ANTI PID CHARACTERISTICS

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LOWER KWH COST

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FUSION HALF CHIP MULTI MAIN GRID TECHNOLOGY

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EXCELLENT LOW LIGHT PERFORMANCE